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- W2213378963 abstract "The pad is one of the most important components in the polishing process. The mechanical properties of the pad determine the removal rate and the polishing characteristics. The asperities on the pad surface involve with the mechanical removal from the workpiece surface and the pad profile is affecting the flatness across the workpiece. However, as the polishing is going on, the pad asperities are gradually worn down and the glazed area increases. The removal rate is reduced and the polishing quality becomes poorer due to the pad surface degradation. Therefore, the pad conditioning process is necessary to regenerate the pad surface by breaking up the glazed. The most common conditioning method is to use a rotating disk coated one side with diamond abrasives. The pad surface is restored by the pad cutting of the diamond abrasives. The accumulation of these cutting by the diamond conditioning is unfortunately affecting the profile of the polishing pad, which results in the unstable polishing results. This paper describes the kinematical model for the pad wear and analyzes the effects of kinematical and geometrical parameters in the pad conditioning process using the diamond disk. The kinematical modeling results were correlated with the actual pad profile induced by the pad conditioning." @default.
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- W2213378963 date "2007-06-01" @default.
- W2213378963 modified "2023-09-24" @default.
- W2213378963 title "컨디셔닝 공정에 의한 연마 패드 형상 변화의 기구학 해석에 관한 연구" @default.
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