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• W2217381959 abstract "Microelectromechanical switches are of interest for low-power circuit applications due to their minimal OFF state leakage current. This paper uses 22-nm CMOS fabrication technology and the clamped cantilever geometry as the basis for establishing design rules for electrostatic nanorelays and estimates the design parameters needed for nanorelay actuation. The adhesive pull-off force of various substrate/cantilever combinations is simulated using molecular dynamics with a force field that parameterizes van der Waals interactions, and measured using atomic force microscopy. Both methods show that for the substrates studied, H-passivated Si produces the least adhesive surface with adhesive pressure close to the critical pressure required for pull-out. Experimental results quantifying adhesion and electrical current conduction show that it is impossible to simultaneously meet the adhesion and current conduction requirements of a nanorelay. We show that contact adhesion is the key parameter limiting the scalability of electromechanical relays at the nanoscale." @default.
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• W2217381959 date "2016-01-01" @default.
• W2217381959 modified "2023-10-15" @default.
• W2217381959 title "Adhesion Limits and Design Criteria for Nanorelays" @default.
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• W2217381959 doi "https://doi.org/10.1109/ted.2015.2496155" @default.
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