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• W2236691103 abstract "Electronic devices are subjected to various usage environments, wherein stresses are induced to components and their interconnections. The level of stress affects the interval of failure occurrences. When the stress level and aging characteristics of sub-material parts are known, the failure occurrence can be predicted. However, the predictions are based on uncertainties and a practical method to help to assess the component interconnection reliability is needed. In this thesis a novel method to utilize the accelerated stress test data for the hazard rate estimates is introduced. The hazard rate expectations of the interconnection elements are presented as interconnection failures in time (i-FIT) figures that can be used as a part of the conventional product reliability estimates. The method utilizes second level reliability test results for a packaging type specific failure occurrence estimates. Furthermore, the results can be used as such in the component packaging reliability estimates. Moreover, a novel method to estimate the interconnection failures in terms of costs is presented. In this novel method the interconnection elements are dealt as cost elements. It is also shown that the costs of the interconnection failures could be very high, if the stress-strength characteristics of the interconnection system are wrongly chosen. The lead-free manufacturing has emphasized the thermal compatibility of the materials of the component, the solder and the Printed Wiring Board. Improper materials for Area Array components will result as excessive component warping during the reflow, as is shown in this thesis. A novel method for estimating the amount of component warping during the lead-free reflow is introduced. In this thesis, a method to predict the second level interconnection hazard rate is introduced. The method utilizes the second level reliability test data in the life time predictions of the component solder joints. The resulted hazard rates can be used as a part of product field performance estimates. Also, the effect of the process variation and the material properties on the lead-free solder joint reliability is introduced." @default.
• W2236691103 created "2016-06-24" @default.
• W2236691103 creator A5083330849 @default.
• W2236691103 date "2008-01-01" @default.
• W2236691103 modified "2023-09-27" @default.
• W2236691103 title "A novel method for hazard rate estimates of the second level interconnections in infrastructure electronics" @default.
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• W2236691103 cites W1931509717 @default.
• W2236691103 cites W1948954026 @default.
• W2236691103 cites W1967558393 @default.
• W2236691103 cites W1968181068 @default.
• W2236691103 cites W1981821213 @default.
• W2236691103 cites W2001082461 @default.
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• W2236691103 cites W2181456214 @default.
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