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• W2241006823 abstract "The influence of H2O2 passivation on the schottky contact properties between Au and Hg3In2Te6 wafer was studied by current-voltage (I-V) measurement and X-ray photoelectron spectroscopy (XPS). The XPS results showed that the binding energy of Hg 4f shift toward higher energy direction for about 0.15 eV and the binding energy of O 1s decreased about 0.18 eV after H2O2 passivation. Moreover, Te(2-) changed into Te(0) and HgO formed on the surface of Hg3In2Te6 at the same time. Meanwhile, the Schottky barrier height of Au/Hg3In2Te6 contact varied from 0.42 eV to 0.38 eV, and the leak current reduced about 5.27 x 10(-4) A after H2O2 passivation which is confirmed by I-V measurement. It can be deduced that the passivated surface of MIT wafer decreased the number of dangling bonding, reduced the surface states and weakened the Fermi level pinning." @default.
• W2241006823 created "2016-06-24" @default.
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• W2241006823 date "2015-09-01" @default.
• W2241006823 modified "2023-09-24" @default.
• W2241006823 title "Effect of Passivation on the Electrical Properties of Au/Hg3In2Te6 Schottky Contact" @default.
• W2241006823 doi "https://doi.org/10.1166/jnn.2015.10527" @default.
• W2241006823 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/26716295" @default.
• W2241006823 hasPublicationYear "2015" @default.
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