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- W2243358532 abstract "The article outlines as an example an IEC 61499 compliance profile, designated: the 'IEC 61499 Compliance Profile for Feasibility Demonstrations'. Currently, most IEC 61499 implementations comply at least in part to this compliance profile. Originally, the profile was developed within the 'Holonic Manufacturing Systems' project to show the inter-vendor feasibility of IEC 61499. The original version was defined by the companies Rockwell Automation, Softing AG and Profactor GmbH. Currently it is hosted and maintained by the company Holobloc Inc. Note: Compliance profiles are typically developed and maintained by organisations not under direct control of the IEC. The scope of this compliance profile is to provide reference definitions for all three aspects (i.e. portability, interoperability and configurability) of IEC 61499 compliance profiles. How these three aspects are defined in the 'IEC 61499 Compliance Profile for Feasibility Demonstrations' is outlined in the article." @default.
- W2243358532 created "2016-06-24" @default.
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- W2243358532 date "2014-05-30" @default.
- W2243358532 modified "2023-10-02" @default.
- W2243358532 title "Appendix B: IEC 61499 Compliance Profile for Feasibility Demonstrations" @default.
- W2243358532 doi "https://doi.org/10.1049/pbce095e_appendixb" @default.
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