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Matches in SemOpenAlex for { <https://semopenalex.org/work/W2246136802> ?p ?o ?g. }

• W2246136802 abstract "Summary form only given. Paper covers the following topics: lead-free solder joints; fan-out wafer level packaging; package failure analysis; ultra-small smart mobile; wearable systems; medical systems; IoT systems; polymers; nanocomposites; electronic packaging; photonic packaging; integrated thermal packaging; power electronics reliability; electronic packaging; interposers; flip chip technologies; wafer level chip scale packaging; microelectronic package reliability; IC package yield; package failure mechanisms; 3D IC integration; and 3D IC packaging." @default.
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• W2246136802 date "2015-05-01" @default.
• W2246136802 modified "2023-09-26" @default.
• W2246136802 title "Professional development courses for the 65th ECTC" @default.
• W2246136802 doi "https://doi.org/10.1109/ectc.2015.7159555" @default.
• W2246136802 hasPublicationYear "2015" @default.
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