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- W2246246688 abstract "This paper presented the corresponding between the yield equation prediction from Poisson, Murphy with wafer actual yield on the silicon wafer with 0.8 μm CMOS technology. The defect analysis with derivative method, current - voltage and capacitance-voltage of diode characteristic measurement, is used to define the defect in p-n junction on silicon wafer. The different sampling numbers of chips are used to calculate the yield. Finally the calculated data and actual would be compared and found that at sampling number is 25, the tolerance from actual yield is less than 3%." @default.
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- W2246246688 date "2015-08-01" @default.
- W2246246688 modified "2023-09-26" @default.
- W2246246688 title "Yield Analysis Based on the Defect Analysis with Derivative Method" @default.
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- W2246246688 doi "https://doi.org/10.4028/www.scientific.net/amm.781.160" @default.
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