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- W2247284930 abstract "The application of micromechanical sensors in extreme harsh environments like combustion engines, turbines or chemical reactors can improve the controlling-efficiency and reduce pollutant emissions. This work presents the design concept of high temperature pressure sensors, capable to operate up to 500 deg C, the fabrication with micro-technologies and the assembly processes. A resistive Wheatstone bridge, based on platinum resistors was designed. The sensor function was modelled using FEM simulations and optimized for a maximum operation pressure of 20 bars. Furthermore the influence of geometric and material dependent parameters on the pressure signal was investigated. With microtechnologies like bulk-micromachining of silicon, reactive ion etching (RIE), lithography and thin film sputtering the transducers were fabricated. Subsequently, the sensors were assembled with a glass soldering process on AlN and Si3N4, low coefficient of thermal expansion (CTE) ceramic substrates. For the high-temperature stable interconnection, platinum thin wire-bonds and a flip-chip-process with gold stud-bumps were realized. The fabricated sensor-assemblies were characterized with respect to their pressure sensitivity at 20 deg C and their cross sensitivity on temperature with a heat-chamber set-up until 500 deg C. A pressure sensitivity of 75 muV/V bar and a temperature dependency of 2.1 muV/V K were observed for a flip-chip assembled sensor with Si3N4-substrate." @default.
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- W2247284930 date "2014-06-03" @default.
- W2247284930 modified "2023-09-27" @default.
- W2247284930 title "Fabrication, Packaging and Characterization of Platinum based Pressure Sensors for Operation at 500 deg C" @default.
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