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- W2247808954 abstract "A thin tape with double-stacked electromagnetic bandgap (EBG) structure is proposed for RFI suppression in this paper. This thin EBG tape sticks on only single side of parallel-plate structure formed by printed-circuit board (PCB) and chassis, which is named as single-sided EBG tape (SS-EBG tape). SS-EBG tape provides a RFI solution in a post-fabricating way and can be fabricated with PCB process. Test boards are fabricated with different kinds of excitation and adopted to validate design concepts. By using double-stacked structure, SS-EBG tape has two bandgaps from 2.18 GHz to 2.51 GHz and from 4.8 GHz to 5.63 GHz. In Wi-Fi bands application, SS-EBG tape can provide additional 10 dB suppression level." @default.
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- W2247808954 date "2015-12-01" @default.
- W2247808954 modified "2023-09-27" @default.
- W2247808954 title "Post-fabricated EBG tape on electronic devices for RFI mitigation in WLAN bands" @default.
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- W2247808954 doi "https://doi.org/10.1109/edaps.2015.7383711" @default.
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