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- W2247874558 abstract "Today the requirements for the packaging of optoelectronics and MEMS devices can no longer be met with standard flux-based processes which use a long temperature reflow profile and are implementing a lot of mechanical handling steps and processes. Basically, the packaging of these new devices requires fluxless soldering, no thermal stress by localized heating, low respectively no mechanical contact and damage on sensitive membranes in MEMS or optical components (like lenses, etc.). Some of these applications even require 3D-packaging and selective solder application in 3D-structures, like cavity, vertical assembly, etc. An additional, very challenging requirement is a high flexibility in solder alloys because eutectic SnPb and other lead-based solder alloys are not applicable. Instead AuSn and Indium-based solder alloys are required. In order to fulfill the specific needs in these applications, a new laser-based solder jetting technology has been developed. This technology fulfills all the needs of fluxless soldering, local heating and reflow, no mechanical contact and stress during soldering, high solder alloy flexibility and capability of 3D-packaging. Prior to developing the Solder Ball Bumper Jet (SB 2 -Jet) process, many potential applications have been elaborated using the Solder Ball Bumping (SB 2 )-technology. The advantage of SB 2 -Jet is basically the higher throughput which the jet process. With a throughput of 10 balls/s, it fulfills most of the requirements for today's packaging of optoelectronics and MEMS devices in production. A further increase in speed to 20 and 30 balls/s is in progress for the next generation. An additional feature of the SB 2 - and SB 2 -Jet-technology is the repair option and repair capability. This permits individual removal and replacement of solder balls and solder contacts and allows to increase the yield and productivity of cost-intensive high end devices." @default.
- W2247874558 created "2016-06-24" @default.
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- W2247874558 date "2002-01-01" @default.
- W2247874558 modified "2023-09-23" @default.
- W2247874558 title "Placement and reflow of solder balls for FC, BGA, wafer-level-CSP, optoelectronic components and MEMS by using a new solder jetting method" @default.
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