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- W2252439097 endingPage "000553" @default.
- W2252439097 startingPage "000548" @default.
- W2252439097 abstract "Three Dimensional (3D) Packaging has become an industry obsession as the market demand continues to grow toward higher packaging densities and smaller form factor. In the meanwhile, the 3D die-to-wafer (D2W) packaging structure is gaining popularity due to its high manufacturing throughput and low cost per package. In this paper, the development of the assembly process for a 3D die-to-wafer packaging technology, that leverages the wafer level assembly technique and flip chip process, is introduced. Research efforts were focused on the high-density flip chip wafer level assembly techniques, as well as the challenges, innovations and solutions associated with this type of 3D packaging technology. Processing challenges and innovations addressed include flip chip fluxing methods for very fine-pitch and small bump sizes; wafer level flip chip assembly program creation and yield improvements; and set up of the Pb-free reflow profile for the assembled wafer. 100% yield was achieved on the test vehicle wafer that has totally 1,876 flip chip dies assembled on it. This work has demonstrated that the flip chip 3D die-to-wafer packaging architecture can be processed with robust yield and high manufacturing throughput, and thus to be a cost effective, rapid time to market alternative to emerging 3D wafer level integration methodologies." @default.
- W2252439097 created "2016-06-24" @default.
- W2252439097 creator A5019833004 @default.
- W2252439097 creator A5020252732 @default.
- W2252439097 creator A5023907112 @default.
- W2252439097 creator A5027183929 @default.
- W2252439097 creator A5039467339 @default.
- W2252439097 creator A5065246138 @default.
- W2252439097 creator A5073415479 @default.
- W2252439097 date "2010-01-01" @default.
- W2252439097 modified "2023-09-25" @default.
- W2252439097 title "Wafer Level Assembly Technique Development for Fine Pitch Flip Chip 3D Die-to-Wafer Integration" @default.
- W2252439097 cites W2102365301 @default.
- W2252439097 cites W2109782100 @default.
- W2252439097 cites W2109929251 @default.
- W2252439097 cites W2121551953 @default.
- W2252439097 cites W2126908750 @default.
- W2252439097 doi "https://doi.org/10.4071/isom-2010-wp1-paper3" @default.
- W2252439097 hasPublicationYear "2010" @default.
- W2252439097 type Work @default.
- W2252439097 sameAs 2252439097 @default.
- W2252439097 citedByCount "0" @default.
- W2252439097 crossrefType "journal-article" @default.
- W2252439097 hasAuthorship W2252439097A5019833004 @default.
- W2252439097 hasAuthorship W2252439097A5020252732 @default.
- W2252439097 hasAuthorship W2252439097A5023907112 @default.
- W2252439097 hasAuthorship W2252439097A5027183929 @default.
- W2252439097 hasAuthorship W2252439097A5039467339 @default.
- W2252439097 hasAuthorship W2252439097A5065246138 @default.
- W2252439097 hasAuthorship W2252439097A5073415479 @default.
- W2252439097 hasConcept C111106434 @default.
- W2252439097 hasConcept C117671659 @default.
- W2252439097 hasConcept C119599485 @default.
- W2252439097 hasConcept C125619702 @default.
- W2252439097 hasConcept C126355924 @default.
- W2252439097 hasConcept C127413603 @default.
- W2252439097 hasConcept C160671074 @default.
- W2252439097 hasConcept C165005293 @default.
- W2252439097 hasConcept C165013422 @default.
- W2252439097 hasConcept C171250308 @default.
- W2252439097 hasConcept C192562407 @default.
- W2252439097 hasConcept C24326235 @default.
- W2252439097 hasConcept C2779227376 @default.
- W2252439097 hasConcept C2780288131 @default.
- W2252439097 hasConcept C35750839 @default.
- W2252439097 hasConcept C44445679 @default.
- W2252439097 hasConcept C49040817 @default.
- W2252439097 hasConcept C68928338 @default.
- W2252439097 hasConcept C79072407 @default.
- W2252439097 hasConceptScore W2252439097C111106434 @default.
- W2252439097 hasConceptScore W2252439097C117671659 @default.
- W2252439097 hasConceptScore W2252439097C119599485 @default.
- W2252439097 hasConceptScore W2252439097C125619702 @default.
- W2252439097 hasConceptScore W2252439097C126355924 @default.
- W2252439097 hasConceptScore W2252439097C127413603 @default.
- W2252439097 hasConceptScore W2252439097C160671074 @default.
- W2252439097 hasConceptScore W2252439097C165005293 @default.
- W2252439097 hasConceptScore W2252439097C165013422 @default.
- W2252439097 hasConceptScore W2252439097C171250308 @default.
- W2252439097 hasConceptScore W2252439097C192562407 @default.
- W2252439097 hasConceptScore W2252439097C24326235 @default.
- W2252439097 hasConceptScore W2252439097C2779227376 @default.
- W2252439097 hasConceptScore W2252439097C2780288131 @default.
- W2252439097 hasConceptScore W2252439097C35750839 @default.
- W2252439097 hasConceptScore W2252439097C44445679 @default.
- W2252439097 hasConceptScore W2252439097C49040817 @default.
- W2252439097 hasConceptScore W2252439097C68928338 @default.
- W2252439097 hasConceptScore W2252439097C79072407 @default.
- W2252439097 hasIssue "1" @default.
- W2252439097 hasLocation W22524390971 @default.
- W2252439097 hasOpenAccess W2252439097 @default.
- W2252439097 hasPrimaryLocation W22524390971 @default.
- W2252439097 hasRelatedWork W1524222254 @default.
- W2252439097 hasRelatedWork W1546975856 @default.
- W2252439097 hasRelatedWork W1859212646 @default.
- W2252439097 hasRelatedWork W1928544355 @default.
- W2252439097 hasRelatedWork W1982933499 @default.
- W2252439097 hasRelatedWork W2080846299 @default.
- W2252439097 hasRelatedWork W2118593519 @default.
- W2252439097 hasRelatedWork W2164231539 @default.
- W2252439097 hasRelatedWork W2252439097 @default.
- W2252439097 hasRelatedWork W2540312267 @default.
- W2252439097 hasVolume "2010" @default.
- W2252439097 isParatext "false" @default.
- W2252439097 isRetracted "false" @default.
- W2252439097 magId "2252439097" @default.
- W2252439097 workType "article" @default.