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- W2254716175 abstract "Recent improvements in high density interconnect technologies bring new options for microelectronic device processes. One of these options is currently explored for CMOS image sensor (CIS) applications. The high interconnect density is used to create one bond point per pixel while maintaining a relatively low pixel pitch. The resulting electro-optical performances are improved and the constraints on electronic readout circuit are relaxed. The advantages are particularly interesting for SPAD arrays. The SPADs need large area electronic readout circuits. Moreover, their intrinsic sensitivity makes them vulnerable to the noise induced by the close proximity of the digital readout circuits. This work analyzes the benefits and limitations of the 3D high density interconnect process. The laboratory’s experience of the design of a 3D-IC conventional CIS is used to design and simulate a SPAD array image sensor; showing the possibilities for both performances and system level integration." @default.
- W2254716175 created "2016-06-24" @default.
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- W2254716175 date "2015-11-01" @default.
- W2254716175 modified "2023-09-27" @default.
- W2254716175 title "Exploration of high density interconnect 3D stacking for SPAD arrays" @default.
- W2254716175 hasPublicationYear "2015" @default.
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