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- W2269517067 abstract "Wet etching of p-Cu<sub>2</sub>O films in ammonia solution reduces surface impurities, further texturizes the surface, and improves Cu<sub>2</sub>O homojunction interface quality." @default.
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- W2269517067 date "2016-01-01" @default.
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- W2269517067 title "Etching of electrodeposited Cu<sub>2</sub>O films using ammonia solution for photovoltaic applications" @default.
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- W2269517067 doi "https://doi.org/10.1039/c5cp06385j" @default.
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