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- W2270251832 abstract "A novel low-cost and high-speed via filling method using Cu-cored solder balls was investigated for through-silicon via manufacture. Cu-cored solder balls with a total diameter of 100 μm were used to fill 150 μm deep, 110 μm wide vias in silicon. The wafer-level filling process can be completed in a few seconds, which is much faster than using the traditional electroplating process. Thermo-mechanical analysis of via filling using solder, Cu and Cu-cored solder was carried out to assess the thermo-mechanical properties of the different filling materials. It was found that the vias filled with Cu-cored solder exhibit less thermal-mechanical stresses than solder-filled vias, but more than Cu-filled vias." @default.
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- W2270251832 date "2012-08-01" @default.
- W2270251832 modified "2023-09-26" @default.
- W2270251832 title "High-speed through-silicon via filling method using Cu-cored solder balls" @default.
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- W2270251832 doi "https://doi.org/10.1088/1674-4926/33/8/086002" @default.
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