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- W2273847693 abstract "The structural performance of electronic devices depends immensely on the standoff height of the components used to assemble them. The component standoff height (CSH) of electronic assemblies can be varied either by changing the settings of the reflow profile parameters or by varying the diameter of bond pad on the printed circuit board (PCB). The continued desire by electronic manufacturing industries to improve the reliability of their devices has driven researchers to seek in-depth understanding of the contribution of CSH on the integrity of solder joints in these assemblies. This is coupled with the fact that there is no industry standard for CSH, for electronic components. This investigation studies the effect of CSH on the shear strength and failure mechanism of assembled Ball Grid Array (BGA) electronic components. Five different CSHs were investigated using a number of test vehicles. The various CSHs were achieved by varying the bond pads on the PCB while keeping the reflow profile parameters constant. These test vehicles were subjected to shear stress using a Dage 4000 series bond tester. The results obtained demonstrate that the different vehicles produce different load profiles and their shear strength increases with decrease in their CSH. It was found that the mechanics of failure of the specimen is both by crack propagation at the interface between solder bulk and the intermetallic layer; and by pad lifting. These findings would be useful to benchmark the CHS for B GAs, for their optimal mechanical reliability." @default.
- W2273847693 created "2016-06-24" @default.
- W2273847693 creator A5003730557 @default.
- W2273847693 creator A5045080849 @default.
- W2273847693 creator A5051106520 @default.
- W2273847693 creator A5056806211 @default.
- W2273847693 creator A5072349272 @default.
- W2273847693 date "2015-01-01" @default.
- W2273847693 modified "2023-10-01" @default.
- W2273847693 title "Effects of component stand-off height on reliability of solder joints in assembled electronic component" @default.
- W2273847693 cites W2007828539 @default.
- W2273847693 hasPublicationYear "2015" @default.
- W2273847693 type Work @default.
- W2273847693 sameAs 2273847693 @default.
- W2273847693 citedByCount "0" @default.
- W2273847693 crossrefType "proceedings-article" @default.
- W2273847693 hasAuthorship W2273847693A5003730557 @default.
- W2273847693 hasAuthorship W2273847693A5045080849 @default.
- W2273847693 hasAuthorship W2273847693A5051106520 @default.
- W2273847693 hasAuthorship W2273847693A5056806211 @default.
- W2273847693 hasAuthorship W2273847693A5072349272 @default.
- W2273847693 hasConcept C119599485 @default.
- W2273847693 hasConcept C120793396 @default.
- W2273847693 hasConcept C121332964 @default.
- W2273847693 hasConcept C127413603 @default.
- W2273847693 hasConcept C140269135 @default.
- W2273847693 hasConcept C159985019 @default.
- W2273847693 hasConcept C163258240 @default.
- W2273847693 hasConcept C165005293 @default.
- W2273847693 hasConcept C168167062 @default.
- W2273847693 hasConcept C192562407 @default.
- W2273847693 hasConcept C2778309119 @default.
- W2273847693 hasConcept C2778413121 @default.
- W2273847693 hasConcept C41151612 @default.
- W2273847693 hasConcept C43214815 @default.
- W2273847693 hasConcept C50296614 @default.
- W2273847693 hasConcept C62520636 @default.
- W2273847693 hasConcept C66938386 @default.
- W2273847693 hasConcept C69567186 @default.
- W2273847693 hasConcept C78519656 @default.
- W2273847693 hasConcept C81060104 @default.
- W2273847693 hasConcept C94709252 @default.
- W2273847693 hasConcept C96035792 @default.
- W2273847693 hasConcept C97355855 @default.
- W2273847693 hasConceptScore W2273847693C119599485 @default.
- W2273847693 hasConceptScore W2273847693C120793396 @default.
- W2273847693 hasConceptScore W2273847693C121332964 @default.
- W2273847693 hasConceptScore W2273847693C127413603 @default.
- W2273847693 hasConceptScore W2273847693C140269135 @default.
- W2273847693 hasConceptScore W2273847693C159985019 @default.
- W2273847693 hasConceptScore W2273847693C163258240 @default.
- W2273847693 hasConceptScore W2273847693C165005293 @default.
- W2273847693 hasConceptScore W2273847693C168167062 @default.
- W2273847693 hasConceptScore W2273847693C192562407 @default.
- W2273847693 hasConceptScore W2273847693C2778309119 @default.
- W2273847693 hasConceptScore W2273847693C2778413121 @default.
- W2273847693 hasConceptScore W2273847693C41151612 @default.
- W2273847693 hasConceptScore W2273847693C43214815 @default.
- W2273847693 hasConceptScore W2273847693C50296614 @default.
- W2273847693 hasConceptScore W2273847693C62520636 @default.
- W2273847693 hasConceptScore W2273847693C66938386 @default.
- W2273847693 hasConceptScore W2273847693C69567186 @default.
- W2273847693 hasConceptScore W2273847693C78519656 @default.
- W2273847693 hasConceptScore W2273847693C81060104 @default.
- W2273847693 hasConceptScore W2273847693C94709252 @default.
- W2273847693 hasConceptScore W2273847693C96035792 @default.
- W2273847693 hasConceptScore W2273847693C97355855 @default.
- W2273847693 hasLocation W22738476931 @default.
- W2273847693 hasOpenAccess W2273847693 @default.
- W2273847693 hasPrimaryLocation W22738476931 @default.
- W2273847693 hasRelatedWork W1561311599 @default.
- W2273847693 hasRelatedWork W1915169340 @default.
- W2273847693 hasRelatedWork W1941899783 @default.
- W2273847693 hasRelatedWork W1983833012 @default.
- W2273847693 hasRelatedWork W1993654392 @default.
- W2273847693 hasRelatedWork W2053696144 @default.
- W2273847693 hasRelatedWork W2100989681 @default.
- W2273847693 hasRelatedWork W2124280657 @default.
- W2273847693 hasRelatedWork W2127185702 @default.
- W2273847693 hasRelatedWork W2139157050 @default.
- W2273847693 hasRelatedWork W2152844608 @default.
- W2273847693 hasRelatedWork W2171684299 @default.
- W2273847693 hasRelatedWork W2323406304 @default.
- W2273847693 hasRelatedWork W2502772253 @default.
- W2273847693 hasRelatedWork W2897739508 @default.
- W2273847693 hasRelatedWork W2900202369 @default.
- W2273847693 hasRelatedWork W2974059185 @default.
- W2273847693 hasRelatedWork W3021837599 @default.
- W2273847693 hasRelatedWork W3088751369 @default.
- W2273847693 hasRelatedWork W3205821753 @default.
- W2273847693 isParatext "false" @default.
- W2273847693 isRetracted "false" @default.
- W2273847693 magId "2273847693" @default.
- W2273847693 workType "article" @default.