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- W2275377545 abstract "The mechanism of intermetallic compound (IMC) between Copper (Cu) free air ball (FAB) and Aluminum (Al) bond pad has been carefully investigated in this paper. The test vehicle is Pd-coated Cu wirebonds on Al pad in plastic ball grid array (PBGA) package. Palladium (Pd), the anti-oxide material coated on Cu wire will be blended in the Cu FAB when the ball is formed by an electrical flame-off (EFO). Preliminary results demonstrated that CuAl IMC cracks originally begins from the edge of bonding interface and spreads into the center area. This is the cause of open fail. Nanoscale bondabilities on IMC of Cu/Cu9Al4 and CuAl2/Al are also cautiously investigated by using molecular dynamics (MD) simulations. Nanoscale tensile force and tensile strength are predicted to examine the bonding strength of two IMCs along the bonding interface. Interfacial fracture is different in different tensile speed as well as the working temperature. A series of experimental works and MD simulations are conducted in this research." @default.
- W2275377545 created "2016-06-24" @default.
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- W2275377545 date "2013-04-01" @default.
- W2275377545 modified "2023-09-23" @default.
- W2275377545 title "An Investigation on Nanoscale Tensile Mechanical Properties for Pd-coated Copper Wire" @default.
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