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- W2275609657 abstract "This annual report details activities for TRP Flip Chip Attached Project. The IBM/Universal Instruments team has completed the first year effort on the Electrically Conductive Adhesive Flip Chip Attach project. IBM-Yorktown has worked closely with IBM Endicott to develop a Polymer Metal Solvent Paste (PMSP) that can be processed to form a cylindrically shaped deposit. IBM Endicott has done extensive work on bonding. This work has identified the key parameters to bond a Polymer Metal Composite (PMC) bumped die to a substrate." @default.
- W2275609657 created "2016-06-24" @default.
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- W2275609657 date "1995-11-09" @default.
- W2275609657 modified "2023-09-23" @default.
- W2275609657 title "Electrically conductive adhesive Flip Chip Attach Project. Annual report, October 1, 1994--October 1, 1995" @default.
- W2275609657 doi "https://doi.org/10.2172/149988" @default.
- W2275609657 hasPublicationYear "1995" @default.
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