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- W2277884525 startingPage "31" @default.
- W2277884525 abstract "用电镀工艺制备了Fe-Ni镀层,研究了还原气氛保护下共晶Sn3.8Ag0.7Cu焊料在Fe-Ni镀层上的反应润湿行为。结果表明：在共晶Sn3.8Ag0.7Cu与Fe-74Ni反应润湿体系观察到了伪部分润湿行为。在铺展球冠的前沿,可以明显地看到有液态膜伸出主液体铺展前沿。随着回流时间的增加,液态膜逐渐长大。共晶Sn3.8Ag0.7Cu焊料与Fe-74Ni电镀合金层的液固界面生成了一层FeSn2化合物,还有大量Cu/Ni/Sn化合物进入焊料内部。" @default.
- W2277884525 created "2016-06-24" @default.
- W2277884525 creator A5041489054 @default.
- W2277884525 creator A5054240011 @default.
- W2277884525 date "2014-01-01" @default.
- W2277884525 modified "2023-09-23" @default.
- W2277884525 title "共晶Sn3.8Ag0.7Cu焊料在Fe-Ni镀层上的反应润湿行为" @default.
- W2277884525 hasPublicationYear "2014" @default.
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