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- W2279122058 abstract "Wireless telecommunication, broadcast and radar industries rely on high power transmission of the radio waves to reach subscribers or measure the environment. As the wireless revolution extends, component requirement in higher frequency, elevated operating power, smaller in size, and improved performance demands on resistive devices grow even more stringent. In this work, we extensively studied to improve the power handling capability of termination resistor while maintaining the smaller size. We optimized the energy transmission within the component and significantly improved the efficiency of energy transfer between the transmission lines and the terminations. We explored several innovative techniques to optimize thermal management. We applied new packaging techniques and developed termination resistors with optimum thermal management. We discussed several methods of improving power handling capability and reduction of thermal fatigue to the component’s structure by improving component packaging technology. Applying the packaging technology methods we significantly reduced the chance of solder cracking due to thermal fatigue. Employing novel techniques of heat transfer we appreciably increased power handling capability while keeping the product size as minimum. We constructed matching network using integrated microstrip line at the beginning of the resistor material. Considering required thermal performance, we designed and manufactured Pb free high power termination resistor. Several sizes of resistor are manufactured with rated power of 20 W and 100 W. Thermal profiles of the termination resistors illustrates the high power handling capability of the fabricated termination resistors." @default.
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- W2279122058 date "2011-01-01" @default.
- W2279122058 modified "2023-09-25" @default.
- W2279122058 title "Rated Power Enhancement of Termination Resistor by Employing Innovative Thermal Management Techniques" @default.
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- W2279122058 doi "https://doi.org/10.4071/isom-2011-tha2-paper1" @default.
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