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• W2280599901 abstract "In recent, the laser direct ablation process (LDA) for opening solder resist (SR) is getting the spotlight because this process favors small size opening and process shortening. However, it is concomitant with a desmear process which causes SR whitening defect. The SR whitening, in general, is known to be caused by the diffused reflection of the SR surface reformed and coarsened by the chemical reaction between the permanganate and SR polymer components. The process comprising the surface treatment on the SR prior to conducting LDA is proposed to resolve the problem. Therefore, the whitening defect-free products can be obtained even after the wet chemical desmear or plasma desmear. As an application, selective surface finish products, which are treated by gold surface finish and organic surface finish at different areas in the same substrate, can be fabricated using the LDA process." @default.
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• W2280599901 date "2011-01-01" @default.
• W2280599901 modified "2023-09-25" @default.
• W2280599901 title "Development of Laser Direct Ablation Process on Solder Resist in Printed Circuit Boards" @default.
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• W2280599901 doi "https://doi.org/10.4071/isom-2011-tp5-paper4" @default.
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