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- W2282973178 abstract "The aim of this paper is to present viscoelastic models to accurately simulate mechanical stresses which result from volume expansion during thermal oxidation or temperature ramps in silicon technology. Comparisons are made with wafer curvature measurements and it is shown that mechanical stresses can explain the “anomalously” fast initial regime during dry oxidation, without involving any additional chemical mechanism.KeywordsMechanical StressStress RelaxationThermal OxidationViscoelastic ModelAccurate SimulationThese keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves." @default.
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- W2282973178 date "1993-01-01" @default.
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- W2282973178 title "Accurate Simulation of Mechanical Stresses in Silicon During Thermal Oxidation" @default.
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- W2282973178 doi "https://doi.org/10.1007/978-3-7091-6657-4_42" @default.
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