Matches in SemOpenAlex for { <https://semopenalex.org/work/W2286551467> ?p ?o ?g. }
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- W2286551467 endingPage "18" @default.
- W2286551467 startingPage "15" @default.
- W2286551467 abstract "The through-Si-via (TSV) interconnection provides the ideal 3D interconnection in a next generation semiconductor device which has significantly innovated function, excellent performance and high efficiency. In this study, TSV fillings by electrodeposition of Cu with various current forms were carried out to improve the via filling rate. Especially, the influence of reverse current density and average current density on the TSV filling property was studied. ~7% of improvement in via filling rate compared with using direct current (DC) was achieved by applying the pulse-reverse current form, which was mainly caused by effective adsorption and redistribution of additives inside via. TSV fillings by electrodeposition of Cu with pulse-reverse current were carried out to improve the via filling rate. Influence of reverse current density and average current density on the TSV filling property was focused on.Display Omitted" @default.
- W2286551467 created "2016-06-24" @default.
- W2286551467 creator A5004570608 @default.
- W2286551467 creator A5033857598 @default.
- W2286551467 creator A5056378530 @default.
- W2286551467 creator A5089973078 @default.
- W2286551467 date "2016-04-01" @default.
- W2286551467 modified "2023-09-24" @default.
- W2286551467 title "Through-silicon-via (TSV) filling by electrodeposition with pulse-reverse current" @default.
- W2286551467 cites W1965065362 @default.
- W2286551467 cites W1990434525 @default.
- W2286551467 cites W1996654684 @default.
- W2286551467 cites W1996931382 @default.
- W2286551467 cites W2002312857 @default.
- W2286551467 cites W2004204877 @default.
- W2286551467 cites W2022454657 @default.
- W2286551467 cites W2031332021 @default.
- W2286551467 cites W2034985658 @default.
- W2286551467 cites W2043118838 @default.
- W2286551467 cites W2072148751 @default.
- W2286551467 cites W2128259088 @default.
- W2286551467 cites W2141361504 @default.
- W2286551467 cites W2166999056 @default.
- W2286551467 doi "https://doi.org/10.1016/j.mee.2016.02.020" @default.
- W2286551467 hasPublicationYear "2016" @default.
- W2286551467 type Work @default.
- W2286551467 sameAs 2286551467 @default.
- W2286551467 citedByCount "16" @default.
- W2286551467 countsByYear W22865514672016 @default.
- W2286551467 countsByYear W22865514672017 @default.
- W2286551467 countsByYear W22865514672018 @default.
- W2286551467 countsByYear W22865514672019 @default.
- W2286551467 countsByYear W22865514672020 @default.
- W2286551467 countsByYear W22865514672021 @default.
- W2286551467 countsByYear W22865514672022 @default.
- W2286551467 crossrefType "journal-article" @default.
- W2286551467 hasAuthorship W2286551467A5004570608 @default.
- W2286551467 hasAuthorship W2286551467A5033857598 @default.
- W2286551467 hasAuthorship W2286551467A5056378530 @default.
- W2286551467 hasAuthorship W2286551467A5089973078 @default.
- W2286551467 hasConcept C119599485 @default.
- W2286551467 hasConcept C121332964 @default.
- W2286551467 hasConcept C127413603 @default.
- W2286551467 hasConcept C148043351 @default.
- W2286551467 hasConcept C165801399 @default.
- W2286551467 hasConcept C171250308 @default.
- W2286551467 hasConcept C192562407 @default.
- W2286551467 hasConcept C2780167933 @default.
- W2286551467 hasConcept C45632049 @default.
- W2286551467 hasConcept C49040817 @default.
- W2286551467 hasConcept C544956773 @default.
- W2286551467 hasConcept C61696701 @default.
- W2286551467 hasConceptScore W2286551467C119599485 @default.
- W2286551467 hasConceptScore W2286551467C121332964 @default.
- W2286551467 hasConceptScore W2286551467C127413603 @default.
- W2286551467 hasConceptScore W2286551467C148043351 @default.
- W2286551467 hasConceptScore W2286551467C165801399 @default.
- W2286551467 hasConceptScore W2286551467C171250308 @default.
- W2286551467 hasConceptScore W2286551467C192562407 @default.
- W2286551467 hasConceptScore W2286551467C2780167933 @default.
- W2286551467 hasConceptScore W2286551467C45632049 @default.
- W2286551467 hasConceptScore W2286551467C49040817 @default.
- W2286551467 hasConceptScore W2286551467C544956773 @default.
- W2286551467 hasConceptScore W2286551467C61696701 @default.
- W2286551467 hasFunder F4320321681 @default.
- W2286551467 hasFunder F4320335199 @default.
- W2286551467 hasLocation W22865514671 @default.
- W2286551467 hasOpenAccess W2286551467 @default.
- W2286551467 hasPrimaryLocation W22865514671 @default.
- W2286551467 hasRelatedWork W2139871202 @default.
- W2286551467 hasRelatedWork W2250150703 @default.
- W2286551467 hasRelatedWork W2292675962 @default.
- W2286551467 hasRelatedWork W2312552982 @default.
- W2286551467 hasRelatedWork W2366143041 @default.
- W2286551467 hasRelatedWork W2399397734 @default.
- W2286551467 hasRelatedWork W2769410768 @default.
- W2286551467 hasRelatedWork W2799800065 @default.
- W2286551467 hasRelatedWork W2902546961 @default.
- W2286551467 hasRelatedWork W3127524829 @default.
- W2286551467 hasVolume "156" @default.
- W2286551467 isParatext "false" @default.
- W2286551467 isRetracted "false" @default.
- W2286551467 magId "2286551467" @default.
- W2286551467 workType "article" @default.