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- W2288145299 abstract "Plasmas have been employed in a wide range of industrial applications such as etching, sputtering, and chemical vapor deposition. Plasma etching in other words dry etching is a very critical tool in manufacturing semiconductor devices. Plasma etching is considerably advantageous in comparison to wet etching. Ability to etch fine features and highly anisotropic etch profiles are among the most important benefits of plasma etching. Here we first discuss fundamental features of plasmas including ion sheath and potential distribution in a radio frequency (RF) discharge. Subsequently, reactive ion etching (RIE) technique and major etch mechanisms are being described." @default.
- W2288145299 created "2016-06-24" @default.
- W2288145299 creator A5037040922 @default.
- W2288145299 date "2016-01-01" @default.
- W2288145299 modified "2023-09-27" @default.
- W2288145299 title "Plasma and Reactive Ion Etching" @default.
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- W2288145299 doi "https://doi.org/10.1016/b978-0-12-803581-8.03720-6" @default.
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