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- W2288156622 abstract "The bonded resistance strain gage is an analog electrical sensor ideally suited to the task of measuring surface stains on solid materials. The two most common devices are the popular etched-foil sensor, and the somewhat more exotic semiconductor gage. Etched foil strain gages are produced with thin foil (typically 5 μm) bonded to a thin insulating carrier (typically 25 μm). Semiconductor gages are produced from a semiconductor material (typically 0.1 mm-thick silicon), commonly with an insulating carrier, but often bonded directly to a specimen. Strain gages work on the same principle as engineering strain; i.e., a starting gage length is deformed to a final gage length with a corresponding change in electrical resistance proportional to the deformation. Foundational characteristics, including sensitivity, thermal response, and limiting properties, and use of these sensors in experimental stress analysis applications, including shear measurement, thermal expansion measurement, and principal strain measurement, are reviewed. Electrical circuits used in the interrogation of strain gages are discussed, along with special considerations and exploitation of specific circuit arrangements for solving unique problems. Potential error sources and correction techniques for both the sensors and circuits are covered." @default.
- W2288156622 created "2016-06-24" @default.
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- W2288156622 date "2008-01-01" @default.
- W2288156622 modified "2023-10-03" @default.
- W2288156622 title "Bonded Electrical Resistance Strain Gages" @default.
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- W2288156622 doi "https://doi.org/10.1007/978-0-387-30877-7_12" @default.
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