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• W2288226620 startingPage "016701" @default.
• W2288226620 abstract "Abstract We evaluated room-temperature bonding characteristics of electroplated Au surfaces smoothed by the lift-off and imprint methods. As a result, we found that smoothed surfaces enable strong bonding; on the other hand, electroplated rough surfaces result in very weak bonding. In transmission electron microscopy observations, no delamination was observed at the bonding interface bonded at room temperature using a smooth surface prepared by the lift-off method. Moreover, the hermeticity of the bonding interface prepared using smoothed surfaces was evaluated using diaphragm structures. As a result, we confirmed that good hermetic sealing was achieved using the electroplated Au surface smoothed by the lift-off method." @default.
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• W2288226620 date "2015-12-09" @default.
• W2288226620 modified "2023-10-16" @default.
• W2288226620 title "Room-temperature wafer scale bonding using smoothed Au seal ring surfaces for hermetic sealing" @default.
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• W2288226620 doi "https://doi.org/10.7567/jjap.55.016701" @default.
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