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• W2289161567 abstract "Thermocompression (TC) flip chip (FC) bonding enables packaging of the most advanced semiconductor devices by allowing finer pitch and higher I/O interconnect while minimizing warpage and stress on low-K dielectrics [1, 2] Adoption of thermocompression bonding is accelerating, especially in the high-end memory devices such as Hybrid Memory Cube (HMC), High Bandwidth Memory (HBM) and Wide I/O 2. In these Through-Silicon-Via (TSV) stacked die devices, thermocompression bonding is the only option that allows exceptionally short die-to-die interconnects and the associated device performance improvements. Interest in die-to-substrate bonding is also increasing for high-end applications processors and graphics processors. Especially for thin die stacks, i.e. memory stacks, the use of a pre-applied Non-Conducting underfill Film (NCF) to provide stress relief and package reliability is very attractive. One of the challenges has been somewhat low throughput, in particular because of large bondhead temperature excursions forced by a requirement for sub 100°C temperatures during the transfer of the die to the bondhead. This paper focusses on the method of optimizing NCF processes and introduces a novel method for avoiding the low handover temperature. The results show the ability to reach very high UPH and attractive cost-of-ownership for an NCF process." @default.
• W2289161567 created "2016-06-24" @default.
• W2289161567 creator A5042052394 @default.
• W2289161567 creator A5044807152 @default.
• W2289161567 creator A5048257506 @default.
• W2289161567 creator A5051792940 @default.
• W2289161567 creator A5068448854 @default.
• W2289161567 creator A5079246318 @default.
• W2289161567 creator A5082460452 @default.
• W2289161567 creator A5082741286 @default.
• W2289161567 date "2015-12-01" @default.
• W2289161567 modified "2023-09-24" @default.
• W2289161567 title "Thermocompression flip chip bonding optimization for pre-applied underfill" @default.
• W2289161567 cites W1997117873 @default.
• W2289161567 cites W2042265191 @default.
• W2289161567 cites W2073815131 @default.
• W2289161567 doi "https://doi.org/10.1109/eptc.2015.7412343" @default.
• W2289161567 hasPublicationYear "2015" @default.
• W2289161567 type Work @default.
• W2289161567 sameAs 2289161567 @default.
• W2289161567 citedByCount "5" @default.
• W2289161567 countsByYear W22891615672016 @default.
• W2289161567 countsByYear W22891615672017 @default.
• W2289161567 countsByYear W22891615672022 @default.
• W2289161567 crossrefType "proceedings-article" @default.
• W2289161567 hasAuthorship W2289161567A5042052394 @default.
• W2289161567 hasAuthorship W2289161567A5044807152 @default.
• W2289161567 hasAuthorship W2289161567A5048257506 @default.
• W2289161567 hasAuthorship W2289161567A5051792940 @default.
• W2289161567 hasAuthorship W2289161567A5068448854 @default.
• W2289161567 hasAuthorship W2289161567A5079246318 @default.
• W2289161567 hasAuthorship W2289161567A5082460452 @default.
• W2289161567 hasAuthorship W2289161567A5082741286 @default.
• W2289161567 hasConcept C111106434 @default.
• W2289161567 hasConcept C121332964 @default.
• W2289161567 hasConcept C123745756 @default.
• W2289161567 hasConcept C126233035 @default.
• W2289161567 hasConcept C140269135 @default.
• W2289161567 hasConcept C159985019 @default.
• W2289161567 hasConcept C160671074 @default.
• W2289161567 hasConcept C162877825 @default.
• W2289161567 hasConcept C163258240 @default.
• W2289161567 hasConcept C165005293 @default.
• W2289161567 hasConcept C171250308 @default.
• W2289161567 hasConcept C192562407 @default.
• W2289161567 hasConcept C201845621 @default.
• W2289161567 hasConcept C2779227376 @default.
• W2289161567 hasConcept C31258907 @default.
• W2289161567 hasConcept C41008148 @default.
• W2289161567 hasConcept C43214815 @default.
• W2289161567 hasConcept C45632049 @default.
• W2289161567 hasConcept C49040817 @default.
• W2289161567 hasConcept C50296614 @default.
• W2289161567 hasConcept C530198007 @default.
• W2289161567 hasConcept C544956773 @default.
• W2289161567 hasConcept C59088047 @default.
• W2289161567 hasConcept C62520636 @default.
• W2289161567 hasConcept C68928338 @default.
• W2289161567 hasConcept C76155785 @default.
• W2289161567 hasConcept C79072407 @default.
• W2289161567 hasConceptScore W2289161567C111106434 @default.
• W2289161567 hasConceptScore W2289161567C121332964 @default.
• W2289161567 hasConceptScore W2289161567C123745756 @default.
• W2289161567 hasConceptScore W2289161567C126233035 @default.
• W2289161567 hasConceptScore W2289161567C140269135 @default.
• W2289161567 hasConceptScore W2289161567C159985019 @default.
• W2289161567 hasConceptScore W2289161567C160671074 @default.
• W2289161567 hasConceptScore W2289161567C162877825 @default.
• W2289161567 hasConceptScore W2289161567C163258240 @default.
• W2289161567 hasConceptScore W2289161567C165005293 @default.
• W2289161567 hasConceptScore W2289161567C171250308 @default.
• W2289161567 hasConceptScore W2289161567C192562407 @default.
• W2289161567 hasConceptScore W2289161567C201845621 @default.
• W2289161567 hasConceptScore W2289161567C2779227376 @default.
• W2289161567 hasConceptScore W2289161567C31258907 @default.
• W2289161567 hasConceptScore W2289161567C41008148 @default.
• W2289161567 hasConceptScore W2289161567C43214815 @default.
• W2289161567 hasConceptScore W2289161567C45632049 @default.
• W2289161567 hasConceptScore W2289161567C49040817 @default.
• W2289161567 hasConceptScore W2289161567C50296614 @default.
• W2289161567 hasConceptScore W2289161567C530198007 @default.
• W2289161567 hasConceptScore W2289161567C544956773 @default.
• W2289161567 hasConceptScore W2289161567C59088047 @default.
• W2289161567 hasConceptScore W2289161567C62520636 @default.
• W2289161567 hasConceptScore W2289161567C68928338 @default.
• W2289161567 hasConceptScore W2289161567C76155785 @default.
• W2289161567 hasConceptScore W2289161567C79072407 @default.
• W2289161567 hasLocation W22891615671 @default.
• W2289161567 hasOpenAccess W2289161567 @default.
• W2289161567 hasPrimaryLocation W22891615671 @default.
• W2289161567 hasRelatedWork W1996090865 @default.
• W2289161567 hasRelatedWork W1997117873 @default.
• W2289161567 hasRelatedWork W2017107926 @default.
• W2289161567 hasRelatedWork W2019580557 @default.
• W2289161567 hasRelatedWork W2022208402 @default.
• W2289161567 hasRelatedWork W2022685454 @default.
• W2289161567 hasRelatedWork W2036893280 @default.
• W2289161567 hasRelatedWork W2050810781 @default.
• W2289161567 hasRelatedWork W2073815131 @default.
• W2289161567 hasRelatedWork W2089478236 @default.

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