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- W2289959031 abstract "Electronic packaging can benefit from 3D interconnect devices that combine mechanical and electrical functions on a single 3D-shape part. Design freedom, miniaturisation, simple assembly process, low cost and reliability are some of the advantages that stimulate innovation or replacement of existing products. This monolithic concept was developed for high volume production with moulded thermoplastics as materials used for circuit carriers. Ceramic counterparts have been implemented so far to a smaller extent although their thermal, mechanical and dielectric make them suitable for applications requiring high dimensional stability. This article presents the use of ceramics for 3D-interconnect devices. Ceramics properties will be highlighted with some existing applications. Fabrication processes will be overviewed with emphasis on laser structuring." @default.
- W2289959031 created "2016-06-24" @default.
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- W2289959031 date "2011-09-01" @default.
- W2289959031 modified "2023-09-25" @default.
- W2289959031 title "3D-CERAMIC INTERCONNECTION DEVICES" @default.
- W2289959031 doi "https://doi.org/10.4071/cicmt-2011-tha25" @default.
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