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- W2290761809 abstract "Miniaturized electronic assemblies have emerged that bring about new reliability challenges and, in some cases, have revived the concerns of leadless ceramic carriers on organic substrates. Many chip scale packages are leadless, have a low coefficient of thermal expansion and a low stand-off height. Typical assemblies are very fine-pitch with micro-solder joints having small load bearing areas. The above attributes may be detrimental to long term solder joint integrity and suggest that reliability be looked at carefully, more so than with conventional surface mount assemblies. This paper presents package and assembly thermal stress / reliability models that can help tackle those problems and ensure that assembly reliability is built-in during the early stages of product design. The models have been implemented in a PC-based design-for-reliability tool that enables quick parametric studies on chip, package, board and assembly parameters." @default.
- W2290761809 created "2016-06-24" @default.
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- W2290761809 date "1997-01-01" @default.
- W2290761809 modified "2023-09-23" @default.
- W2290761809 title "RELIABILITY CHALLENGES AND MODELING OF MODERN SOLDERED ASSEMBLIES" @default.
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