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• W2293456258 abstract "The objective of this paper is to develop a new assessment methodology that can determine the solder joint fatigue life of Ball Grid Array (BGA) packages under vibration loading. This research takes a physics of failure (PoF) type approach to damage analysis and models the complete printed wiring board (PWB) assembly. The model developed is a global-local type. The PWB including its support conditions is typically called the global model. A more detailed model that only deals with a local section of the PWB, including the components of interest, is the local model. Sometimes even a more detailed local model of only the critical BGA attachment is used. These various levels of modeling are required since it is not possible to realistically model the complete PWB assembly in enough detail to accurately obtain the critical stresses in the BGA attachment. The curvature induced in the PWB due to the motion of the printed wiring board under vibration causes damage to the component's attachment. In this paper we will focus on the more common types of BGAs, which have been used extensively in telecommunications, military, and aircraft electronics as well as commercial personal portable electronics." @default.
• W2293456258 created "2016-06-24" @default.
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• W2293456258 date "2008-12-01" @default.
• W2293456258 modified "2023-09-24" @default.
• W2293456258 title "Fundamental Understanding of BGA Packaging Subjected to Vibration Loads" @default.
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• W2293456258 doi "https://doi.org/10.29979/jcsme.200812.0010" @default.
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