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• W2294340933 endingPage "49" @default.
• W2294340933 startingPage "43" @default.
• W2294340933 abstract "Glass substrates have outstanding electrical properties, tailorable coefficient of thermal expansion (CTE), high mechanical rigidity, availability in large and thin panel form, and smooth surface for fine line fabrication, and thus, have gained increased attention and interest in microelectronics industry since 2010. While thin glass packaging offers such a plethora of benefits, glass is a brittle material and thus is prone to failure when copper wiring and polymer layers are deposited on it. This experimental and theoretical work aims to understand the mechanics of glass cracking as a result of stress development from multilayer wiring, defect formation from panel dicing, and thermal cycling, then design a solution to prevent such cracks and demonstrate this solution. Dicing defects are simulated by adding a crack into the free edge of the glass and the energy available for crack propagation, G, is determined through a finite element based fracture mechanics approach. Moisture is well known to lower surface energy, resulting in a lower critical energy release rate for glass (GC) in the presence of moisture or water and, at the defect sizes measured, G reaches GC, indicating that the samples will crack while dicing in water. With thinner dielectric material, optimized dicing process, improved glass-polymer adhesion, and solder resist pullback, it is seen that glass cracking and glasspolymer delamination can be eliminated during dicing and subsequent thermal cycling." @default.
• W2294340933 created "2016-06-24" @default.
• W2294340933 creator A5013434958 @default.
• W2294340933 creator A5025656569 @default.
• W2294340933 creator A5038256711 @default.
• W2294340933 creator A5045655197 @default.
• W2294340933 creator A5091337253 @default.
• W2294340933 date "2016-03-01" @default.
• W2294340933 modified "2023-10-16" @default.
• W2294340933 title "Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates" @default.
• W2294340933 cites W1531459087 @default.
• W2294340933 cites W1562116249 @default.
• W2294340933 cites W1574620200 @default.
• W2294340933 cites W1603150318 @default.
• W2294340933 cites W1958759422 @default.
• W2294340933 cites W1970764030 @default.
• W2294340933 cites W2000672009 @default.
• W2294340933 cites W2007197621 @default.
• W2294340933 cites W2008364016 @default.
• W2294340933 cites W2009655383 @default.
• W2294340933 cites W2015614742 @default.
• W2294340933 cites W2022836812 @default.
• W2294340933 cites W2046580005 @default.
• W2294340933 cites W2053801549 @default.
• W2294340933 cites W2053816062 @default.
• W2294340933 cites W2064708242 @default.
• W2294340933 cites W2084464066 @default.
• W2294340933 cites W2094073002 @default.
• W2294340933 cites W2108498594 @default.
• W2294340933 cites W2162357431 @default.
• W2294340933 cites W2193212110 @default.
• W2294340933 doi "https://doi.org/10.1109/tdmr.2015.2507978" @default.
• W2294340933 hasPublicationYear "2016" @default.
• W2294340933 type Work @default.
• W2294340933 sameAs 2294340933 @default.
• W2294340933 citedByCount "23" @default.
• W2294340933 countsByYear W22943409332016 @default.
• W2294340933 countsByYear W22943409332017 @default.
• W2294340933 countsByYear W22943409332018 @default.
• W2294340933 countsByYear W22943409332019 @default.
• W2294340933 countsByYear W22943409332020 @default.
• W2294340933 countsByYear W22943409332021 @default.
• W2294340933 countsByYear W22943409332022 @default.
• W2294340933 countsByYear W22943409332023 @default.
• W2294340933 crossrefType "journal-article" @default.
• W2294340933 hasAuthorship W2294340933A5013434958 @default.
• W2294340933 hasAuthorship W2294340933A5025656569 @default.
• W2294340933 hasAuthorship W2294340933A5038256711 @default.
• W2294340933 hasAuthorship W2294340933A5045655197 @default.
• W2294340933 hasAuthorship W2294340933A5091337253 @default.
• W2294340933 hasConcept C121332964 @default.
• W2294340933 hasConcept C127413603 @default.
• W2294340933 hasConcept C136478896 @default.
• W2294340933 hasConcept C153294291 @default.
• W2294340933 hasConcept C159985019 @default.
• W2294340933 hasConcept C165013422 @default.
• W2294340933 hasConcept C171250308 @default.
• W2294340933 hasConcept C177564732 @default.
• W2294340933 hasConcept C187937830 @default.
• W2294340933 hasConcept C192562407 @default.
• W2294340933 hasConcept C204530211 @default.
• W2294340933 hasConcept C2779227376 @default.
• W2294340933 hasConcept C32860805 @default.
• W2294340933 hasConcept C47463417 @default.
• W2294340933 hasConcept C58396970 @default.
• W2294340933 hasConcept C59085676 @default.
• W2294340933 hasConcept C69567186 @default.
• W2294340933 hasConcept C77595967 @default.
• W2294340933 hasConceptScore W2294340933C121332964 @default.
• W2294340933 hasConceptScore W2294340933C127413603 @default.
• W2294340933 hasConceptScore W2294340933C136478896 @default.
• W2294340933 hasConceptScore W2294340933C153294291 @default.
• W2294340933 hasConceptScore W2294340933C159985019 @default.
• W2294340933 hasConceptScore W2294340933C165013422 @default.
• W2294340933 hasConceptScore W2294340933C171250308 @default.
• W2294340933 hasConceptScore W2294340933C177564732 @default.
• W2294340933 hasConceptScore W2294340933C187937830 @default.
• W2294340933 hasConceptScore W2294340933C192562407 @default.
• W2294340933 hasConceptScore W2294340933C204530211 @default.
• W2294340933 hasConceptScore W2294340933C2779227376 @default.
• W2294340933 hasConceptScore W2294340933C32860805 @default.
• W2294340933 hasConceptScore W2294340933C47463417 @default.
• W2294340933 hasConceptScore W2294340933C58396970 @default.
• W2294340933 hasConceptScore W2294340933C59085676 @default.
• W2294340933 hasConceptScore W2294340933C69567186 @default.
• W2294340933 hasConceptScore W2294340933C77595967 @default.
• W2294340933 hasIssue "1" @default.
• W2294340933 hasLocation W22943409331 @default.
• W2294340933 hasOpenAccess W2294340933 @default.
• W2294340933 hasPrimaryLocation W22943409331 @default.
• W2294340933 hasRelatedWork W1512319868 @default.
• W2294340933 hasRelatedWork W1658268334 @default.
• W2294340933 hasRelatedWork W1999239633 @default.
• W2294340933 hasRelatedWork W2010620911 @default.
• W2294340933 hasRelatedWork W2042307861 @default.
• W2294340933 hasRelatedWork W2066877724 @default.
• W2294340933 hasRelatedWork W2077789538 @default.
• W2294340933 hasRelatedWork W2095906197 @default.

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