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- W2296970682 abstract "The specimens were prepared with high alumina fiber accounting for 0,5%,10% or 15% by mass of the total amount of amorphous silica and high alumina fiber,using phenolic resin as binder,and extra-adding 0 or 0. 5% ZnO as sunscreen to cut the cost of SiO2 nanoporous insulation board. The hot volume stability and thermal conductivity（flat plate method） of the specimens were tested and multi-function simulation equipment was used to study the thermal insulation performance. The results show that:（1） with high alumina fiber addition increasing,the linear shrinkage rate decreases,but thermal conductivity changes a little;（2）adding ZnO can decrease thermal conductivity obviously;（3） for the specimen with ZnO and 15% of high alumina fiber,its cold face temperature hardly rises during the simulation experiment at 1 000 ℃ for 2 h,and the cold face temperature of the specimen with the smallest thickness of 2 cm doesn’t exceed 180 ℃." @default.
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- W2296970682 date "2015-01-01" @default.
- W2296970682 modified "2023-09-22" @default.
- W2296970682 title "High Alumina Fiber Composite SiO2 Based Nanoporous Insulation Boards" @default.
- W2296970682 hasPublicationYear "2015" @default.
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