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- W2299697721 abstract "A comparative study of Sn–3.0Ag–0.5Cu (SAC305) and Au–20Sn solders as die‐attach materials for high‐temperature power electronic applications was performed. The solid‐state interfacial reactions of SAC305 and Au–20Sn solders with a Ni‐plated Si chip and a direct‐bonded‐copper substrate, as well as the growth of interfacial intermetallic compound layers and interfacial stability, were investigated and compared during aging at 150 and 200 °C for up to 2000 h. The SAC305 solder exhibited a higher interfacial intermetallic compound growth rate and a higher consumption rate of the Ni layer than the Au–20Sn solder. The Au–20Sn solder had a superior interfacial stability for high‐temperature power electronic applications. Copyright © 2016 John Wiley & Sons, Ltd." @default.
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- W2299697721 date "2016-03-15" @default.
- W2299697721 modified "2023-10-16" @default.
- W2299697721 title "Comparative study of Au-Sn and Sn-Ag-Cu as die-attach materials for power electronics applications" @default.
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- W2299697721 doi "https://doi.org/10.1002/sia.5998" @default.
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