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• W2313887345 abstract "Silicon alloying of Cu_0.6Te_0.4 results in an amorphous material up to temperatures exceeding 400 °C with a smooth surface morphology, making it compatible with typical device processing temperatures." @default.
• W2313887345 created "2016-06-24" @default.
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• W2313887345 date "2016-01-01" @default.
• W2313887345 modified "2023-10-14" @default.
• W2313887345 title "Study of amorphous Cu–Te–Si thin films showing high thermal stability for application as a cation supply layer in conductive bridge random access memory devices" @default.
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• W2313887345 doi "https://doi.org/10.1039/c6ra04064k" @default.
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