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- W2313893480 abstract "Carbon nanotubes (CNTs) have received much attention for their unique characteristics as a possible alternative to Cu interconnect. Cu interconnect dimensions begin to come into the range of mean free path of electron typically 40nm. This results in surface and grain boundary scattering. Owing to these scattering phenomena resistivity of Cu begins to increase. This drives us to look for new materials for future very large scale integration (VLSI) interconnects. Carbon nanotubes are alternative to copper because of their remarkable conductive, mechanical and thermal properties. They are effectively long, thin cylinders of graphite which is made up of layers of carbon atoms arranged in a hexagonal lattice with stiffest and strongest fibers. Carbon nanotubes have superior properties like current carrying capacity and conductivity compared to Cu interconnect. It exhibits metallic or semi-conducting property depending on chirality. A matlab coding has been developed to evaluate the performance of various carbon nano tubes (CNT). The various parameters evaluated are Resistance, Capacitance and Inductance. The evaluations of these parameters are very important since they affect the performance of the device. I. Introduction Carbon nanotubes are widely used in nanoelectronics because of its mechanical and electrical properties (1). With one hundred times the tensile strength of steel, thermal conductivity better than all but the purest diamond, and electrical conductivity similar to copper, but with the ability to carry much higher currents, they seem to be a wonder material. Metallic carbon nanotubes have been identified as a possible interconnect material of the future technology generations and be heir to Al and Cu interconnects. It can be metallic or semiconducting depending upon chirality. It has a wide range of application in the fields like big markets, flat panel display, lighting, fuel cells, electronics, biosensors, electrostatic painting of composites in products (car parts) . The changes in resistance and capacitance during interconnect scaling poses a serious challenge to the interconnect delay. Therefore the analysis of various parameters like Resistance, Capacitance and Inductance has a significant impact on the performance and reliability of VLSI circuits." @default.
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- W2313893480 date "2012-08-01" @default.
- W2313893480 modified "2023-10-04" @default.
- W2313893480 title "Performance analysis of Carbon Nano Tubes" @default.
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- W2313893480 doi "https://doi.org/10.9790/3021-02815458" @default.
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