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W2315695894 abstract "This paper presents a multilayer wiring board that integrates a copper air-core microinductor to enable a highly compact, chip-scale power converter module. The wiring board is wafer-level fabricated with three 30-μm-thick electroplated copper layers and is subsequently detached from the fabrication wafer to yield a board that is only 90 μm thick for minimum overall module volume. Within this platform, a stacked-spiral air-core microinductor is designed for high-switching-frequency power conversion and yields high inductance density of 128 nH/mm 2 (100 nH/mm 3 by volume, including 600 μm clearances both above and below the inductor to minimize coupling with external conductors). Although this technology is anticipated to be more appropriate for emerging, experimental converters with switching frequencies >30 MHz, a proof-of-concept, ultraminiature (9 mm 2 footprint, 0.7 mm thick) power converter module is presented that utilizes the microinductor wiring board in conjunction with a commercially available surface-mount boost regulator (~4 MHz switching frequency). The converter module yielded a maximum output power of 153 mW at 60% efficiency for a volumetric power density of 24 mW/mm 3 based on the physical volume occupied by the module (13 mW/mm 3 based on the volume needing to be kept clear from external conductors)." @default.
W2315695894 created "2016-06-24" @default.
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W2315695894 date "2014-11-01" @default.
W2315695894 modified "2023-10-01" @default.
W2315695894 title "A Micromachined Wiring Board With Integrated Microinductor for Chip-Scale Power Conversion" @default.
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W2315695894 doi "https://doi.org/10.1109/tpel.2013.2296507" @default.
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