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- W2316610286 abstract "The deposition mechanism in palladium electroless plating from ethylenediamine complex solutions containing trimethylamine borane (TMAB) as a reducing agent was investigated.The TMAB utilization factor was found to be 68% to 86% for palladium deposition and 25% to 32% for boron deposition. The deposition mechanism can be explained by the electrochemical mechanism, based on the following reactions.Local anodic reaction(CH3)3NBH3+2H2O→(CH3)3N+BO2-+7H+6e-Local cathodic reactionPd2++2e-→PdmPd2++(CH3)3NBH3+(2m-3)e-→PdmB+(CH3)3N+3H+" @default.
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- W2316610286 date "1996-01-01" @default.
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- W2316610286 title "Mass Balance and Deposition Mechanism of Electroless Palladium Plating Using Trimethylamine Borane as a Reducing Agent." @default.
- W2316610286 doi "https://doi.org/10.4139/sfj.47.725" @default.
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