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- W2317149740 abstract "In the electronics packaging design, the growing complexities in conjunction with decrease in design margins are the underlying elements driving the need for a new reliability design method applicable to trade-off problems. In this work, multidisciplinary reliability analysis based on a probabilistic and multivariate statistical method has been performed for CPU module packaging in order to reveal the reliability relationship among packaging solutions and to identify the statistical trade-off mechanism among multi-objectives. It was verified that the applied method involving RSM (Response Surface Modeling) / FORM (First Order Reliability Method) / SEM (Structural Equation Modeling) can assess the packaging solutions with respect to reliability indices and failure mode correlation, and grasp the trade-off mechanism among multi-failure modes in packaging design space." @default.
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- W2317149740 date "2004-08-30" @default.
- W2317149740 modified "2023-10-16" @default.
- W2317149740 title "Multidisciplinary Reliability Design of Electronics Packaging" @default.
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- W2317149740 doi "https://doi.org/10.2514/6.2004-4621" @default.
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