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- W2318831408 startingPage "1121" @default.
- W2318831408 abstract "It was experimentally shown that when nickel oxide films were formed on nickel films electrodeposited by controlled potential technique, solderability declined with increasing quantity of electricity in anodic oxidation. Nickel films 1∼7μm in thickness were electrodeposited from a Watts bath. The real thickness of nickel oxide films was represented by the quantity of electricity in anodic oxidation because measurement by ellipsometry had a large error. Soldering to electrodeposited nickel films was virtually impossible in anodic oxidation at quantities over 15.5×10-3C cm-2. Solderability was not affected at quantities below 3.0×10-3C cm-2. After nickel electrodeposition, the nickel oxide films were dissolved by hydrogen forming by cathodic reduction at -1.40V vs. Ag/AgCl and solderability was raised." @default.
- W2318831408 created "2016-06-24" @default.
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- W2318831408 date "1994-01-01" @default.
- W2318831408 modified "2023-09-23" @default.
- W2318831408 title "Influence of the Oxide Film on the Solderability of Nickel Electrodeposits." @default.
- W2318831408 doi "https://doi.org/10.4139/sfj.45.1121" @default.
- W2318831408 hasPublicationYear "1994" @default.
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