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• W2320134650 abstract "Conductor sizing of wiring for industrial and aerospace applications is now-a-days based on SAE-50881 a raw categorized method that is generally accepted and widely used in the industry. The method can be traced back to the early 50s following the successive series of MIL–W-5088 standards. In SAE AS50881 wire (conductor) sizing is based on heat losses due to the electrical resistance (when carrying a constant duty current) and the maximum allowed temperature of a free wire cooled by ambient air convection. It is demonstrated with the construction of a Thermal Mathematical Model, taking into account air convection properties and heat radiation, that a thermal balance between heating and cooling for the calculation matches with the requirements in the standards. The maximum free wire current in ambient air is derated for altitude, number of wires in a bundle, load conditions and air temperature. It is speculated that over-conservative derating factors are typically part of the system design e.g. at the maximum air temperature, lowest pressure, largest bundle size under a maximum load are usually taken by the equipment suppliers. Poor cooling conditions such as an elevated air temperature due to neighboring bundles and/or limited convection due to structural enclosures are not considered. Also heat radiation is not always taken into account. It is therefore to be expected that application of SAE-AS50881 for aircraft bundle designs or ECSS-Q30-11A for space bundles leads to significant uncertainties in derating factors and actual wire temperatures of aerospace applications. Besides too heavy harness designs this could lead to unacceptable high bundle temperatures with respect to sensitive wire/cable content or structural parts subject to temperature limitations. A Thermal Design Model (TDM) was constructed and validated for predicting of the heat transfer coefficients of bundles and wire temperatures inside bundles. Six samples between 14 mm to 16 mm diameter and several configurations were tested under representative temperatures between -55C to +70C and pressure conditions between 120 mBar to 1 Bar (50.000 feet to sea level). Evaluation of the test results revealed a wosrt case temperature prediction accuracy of ±19C, related to modeling and manufacturing uncertainties. Improvements of the modeling for enclosures and extension of the validation range for 5-35 mm bundles in aircraft enclosures, vacuum (space) or low pressure CO2 (Mars) conditions are recommended. Including prediction of axial heat leak is under investigation for space applications. Thermal analysis of wiring bundles for aerospace applications should result in optimized bundle designs in terms of weight reduction and improved safety." @default.
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• W2320134650 date "2011-07-17" @default.
• W2320134650 modified "2023-10-05" @default.
• W2320134650 title "THERMAL ANALYSIS OF WIRING BUNDLES FOR WEIGHT REDUCTION AND IMPROVED SAFETY" @default.
• W2320134650 doi "https://doi.org/10.2514/6.2011-5111" @default.
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