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- W2321188052 abstract "Cu(Mn) alloy seed BEOL studies revealed fundamental insights into Mn segregation and EM enhancement. A metallic-state Mn-rich Cu layer was under the MnOx layer at the Cu/SiCNH cap interface, and was correlated this metallic layer with additional EM enhancement. A carbonyl-based CVD-Co liner film consumed Mn, reducing its segregation and EM benefit, suggesting O-free Co liner films are strategic for Cu-alloy seed extendibility." @default.
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- W2321188052 date "2014-01-01" @default.
- W2321188052 modified "2023-09-25" @default.
- W2321188052 title "Extendibility of CuMn Alloy-Seed Interconnects and the Fundamentals" @default.
- W2321188052 doi "https://doi.org/10.1380/jsssj.35.244" @default.
- W2321188052 hasPublicationYear "2014" @default.
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