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- W2321562418 abstract "Reductions of 10 to 100 have been realized in the size, weight, and power of space flight electronics while improving reliability and reducing fabrication costs by using custom and semi-custom VLSI microelectronics and sealed (5000 f i of Si&) chip-on-board (COB) assembly. Both the mixed mode microcircuits and COB process have recently been approved by NASA for the ISTP/GGS satellite program. Mixed-mode analoddigital integrated circuits have flown on the TIROS-I spacecraft (MAXIE instrument), and will be flown on the NASMSTP POLAR spacecraft (SEPS, PIXIE, and CEPPAD/IPS instruments) and the P91-1 ARGOS spacecraft (SPADUS instrument). The analog portion of a single array microcircuit contains about 80 operational amplifiers which may be used as low noise amplifiers, filters, A/D and D/A converters, sample/hoid circuits, or voltage references. About 55% of the array is available for digital circuit functions. The base array for these devices is designed for radiation hardness and the CMOS process allows for low power, typically 20 mW per chip. Three td ' Copyright 01995 by the American Institude of Aeronautics and Astronatics, Inc. All rights rescned microcircuits using this array were developed for the SEPS instrument are described: 1) a 16channel low noise front-end amplifier chip with D/A converters and coincidence logic; 2) a flash pulse height analyzer chip with eight 16-bit scalers with overflow; and 3) a general purpose input/output chip with A/D and D/A converters, parallel and serial ports, clock oscillator, counter-timer, interrupt controller, decoder, and other functions. A prototype CCD analog microchip that includes camera-related control and spacecraft interface IO functions was developed." @default.
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- W2321562418 date "1995-01-09" @default.
- W2321562418 modified "2023-09-27" @default.
- W2321562418 title "Miniaturized electronics for space flight applications" @default.
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- W2321562418 doi "https://doi.org/10.2514/6.1995-617" @default.
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