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- W2324380754 abstract "This study investigated the removal of glass spheres from the surface of a silicon substrate by using electrostatic adhesion force. An upper silicon electrode and a dielectric film, such as polyethylene (PE) and polyvinylchloride, were placed on a lower silicon electrode to which the glass spheres were adhered, and a high voltage was applied to the two silicon electrodes for about 60 s. Glass spheres with a diameter of 0.105-0.125 mm were removed by the PE film at voltage of over 500 V, but those with a diameter of 0.04-0.09 mm showed low removal rates. The dielectric film could not contact smaller glass spheres deposited near larger ones, which lowered the removal force for the smaller spheres. Repeating the removal process showed a high removal rate of about 90% after the fifth iteration with an applied voltage of 2,510 V. This means that the largest glass spheres were removed by the first process, and the smaller ones were removed by the subsequent processes." @default.
- W2324380754 created "2016-06-24" @default.
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- W2324380754 date "2013-01-01" @default.
- W2324380754 modified "2023-09-26" @default.
- W2324380754 title "Removal of the Particles on a Silicon Surface using Electrostatic Force" @default.
- W2324380754 cites W2060027611 @default.
- W2324380754 doi "https://doi.org/10.3131/jvsj2.56.273" @default.
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