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- W2326402466 abstract "As an emerging technology for on-chip interconnect scaling in vertical direction in semiconductor industry, through-silicon-via (TSV) demonstrates its advantages and has been adopted for 3D SoC implementation. In this paper, game theory based 3D SoC test architecture optimization and test scheduling method is proposed. Three kinds of stacked SoCs are built using ITC'02 SoC test benchmarks, and experimental results on them show the advantages of the proposed method over prior work." @default.
- W2326402466 created "2016-06-24" @default.
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- W2326402466 date "2014-08-24" @default.
- W2326402466 modified "2023-09-27" @default.
- W2326402466 title "3D SoC Test Optimization Based on Game Theory" @default.
- W2326402466 cites W2014515940 @default.
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- W2326402466 doi "https://doi.org/10.14257/astl.2014.53.28" @default.
- W2326402466 hasPublicationYear "2014" @default.
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