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• W2326599158 endingPage "1685" @default.
• W2326599158 startingPage "1679" @default.
• W2326599158 abstract "Atomic layer deposition (ALD) is used to grow Al-incorporated HfO2 to study the relationship between the film composition variations in the growth direction and thermal stability of the amorphous phase. Ten nm films with Hf:Al ALD cycle ratios equal to 3:1 and 8:1 remain amorphous up to 900 and 800 °C, respectively, and crystallize after a 30 s annealing at 950 and 850 °C, respectively. Angle-resolved X-ray photoelectron spectroscopy is used to reveal the periodicity of ALD-grown Al-incorporated HfO2. Generally, multiple cycles are required to realize a complete layer in ALD. Films with a Hf:Al ALD cycle ratio of ≥5 have a periodic HfO2−HfAlxOy structure, while films with a Hf:Al ALD cycle ratio of <4 appear more like homogeneous films. Increasing the thickness of a homogeneous-like film (Hf:Al = 3:1 ALD cycle ratio) from 10 to 40 nm leads to crystallization when annealed at 900 °C. Amorphous films with a periodic structure (Hf:Al = 8:1, ALD cycle ratio) do not display a dependence of crystallization on film thickness at the same 800 °C annealing condition. The factors controlling the film thermal stability are not only the overall amorphzier incorporation concentration but also how the amorphizer is distributed in the film. Changing the periodic structure of an ALD-grown Al-incorporated HfO2 film is a potential method to tune the film thermal stability." @default.
• W2326599158 created "2016-06-24" @default.
• W2326599158 creator A5032082469 @default.
• W2326599158 creator A5071426093 @default.
• W2326599158 date "2011-03-01" @default.
• W2326599158 modified "2023-09-30" @default.
• W2326599158 title "Structure versus Thermal Stability: The Periodic Structure of Atomic Layer Deposition-Grown Al-Incorporated HfO₂ Films and Its Effects on Amorphous Stabilization" @default.
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• W2326599158 doi "https://doi.org/10.1021/cm102057d" @default.
• W2326599158 hasPublicationYear "2011" @default.
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