FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2326846524> ?p ?o ?g. }

• W2326846524 endingPage "74" @default.
• W2326846524 startingPage "70" @default.
• W2326846524 abstract "This study investigates the fabrication process for microlens array using the solution of photoresist and solvent. A silicon substrate, where micro holes have been made in advance by deep reactive ion etch process, is coated with the solution of the photoresist and solvent. And the substrate is heated so that the solvent evaporates and the volume of the solution shrinks. Due to the surface tension of the liquid, the photoresist in the holes will have concave meniscus after the evaporation of the solvent, which can be used as a mold for the microlens arrays. The geometry of the microlens can be adjusted by changing the concentration of the solution, which is related to the volume shrinkage ratio during the evaporation. Experiments have shown that the microlenses with various heights can be fabricated out of the same substrate. This study is expected to provide a new fabrication method which enables great flexibility of designing microlens array for various optical applications." @default.
• W2326846524 created "2016-06-24" @default.
• W2326846524 creator A5020032006 @default.
• W2326846524 creator A5022780804 @default.
• W2326846524 creator A5067466693 @default.
• W2326846524 creator A5068344018 @default.
• W2326846524 creator A5087937108 @default.
• W2326846524 date "2014-12-01" @default.
• W2326846524 modified "2023-10-14" @default.
• W2326846524 title "A study on the fabrication of microlens array based on the volume shrinkage of the photoresist solution during evaporation" @default.
• W2326846524 cites W1967260242 @default.
• W2326846524 cites W1970248464 @default.
• W2326846524 cites W1976611136 @default.
• W2326846524 cites W1977509562 @default.
• W2326846524 cites W1989237897 @default.
• W2326846524 cites W1991135262 @default.
• W2326846524 cites W1999587440 @default.
• W2326846524 cites W2002161083 @default.
• W2326846524 cites W2003480652 @default.
• W2326846524 cites W2009321338 @default.
• W2326846524 cites W2020580379 @default.
• W2326846524 cites W2022854541 @default.
• W2326846524 cites W2023407259 @default.
• W2326846524 cites W2028991261 @default.
• W2326846524 cites W2036518882 @default.
• W2326846524 cites W2040243213 @default.
• W2326846524 cites W2040291264 @default.
• W2326846524 cites W2041411358 @default.
• W2326846524 cites W2045098484 @default.
• W2326846524 cites W2045653029 @default.
• W2326846524 cites W2049567926 @default.
• W2326846524 cites W2050637232 @default.
• W2326846524 cites W2057611940 @default.
• W2326846524 cites W2073326268 @default.
• W2326846524 cites W2080209813 @default.
• W2326846524 cites W2081003902 @default.
• W2326846524 cites W2083414479 @default.
• W2326846524 cites W2084291741 @default.
• W2326846524 cites W2084965002 @default.
• W2326846524 cites W2086027626 @default.
• W2326846524 cites W2087363527 @default.
• W2326846524 cites W2088153994 @default.
• W2326846524 cites W2098731681 @default.
• W2326846524 cites W2101821568 @default.
• W2326846524 cites W2139462495 @default.
• W2326846524 cites W2165310448 @default.
• W2326846524 doi "https://doi.org/10.1016/j.optcom.2014.06.064" @default.
• W2326846524 hasPublicationYear "2014" @default.
• W2326846524 type Work @default.
• W2326846524 sameAs 2326846524 @default.
• W2326846524 citedByCount "5" @default.
• W2326846524 countsByYear W23268465242015 @default.
• W2326846524 countsByYear W23268465242017 @default.
• W2326846524 countsByYear W23268465242022 @default.
• W2326846524 crossrefType "journal-article" @default.
• W2326846524 hasAuthorship W2326846524A5020032006 @default.
• W2326846524 hasAuthorship W2326846524A5022780804 @default.
• W2326846524 hasAuthorship W2326846524A5067466693 @default.
• W2326846524 hasAuthorship W2326846524A5068344018 @default.
• W2326846524 hasAuthorship W2326846524A5087937108 @default.
• W2326846524 hasConcept C111368507 @default.
• W2326846524 hasConcept C120665830 @default.
• W2326846524 hasConcept C121332964 @default.
• W2326846524 hasConcept C127313418 @default.
• W2326846524 hasConcept C134406635 @default.
• W2326846524 hasConcept C136525101 @default.
• W2326846524 hasConcept C142724271 @default.
• W2326846524 hasConcept C15336307 @default.
• W2326846524 hasConcept C159985019 @default.
• W2326846524 hasConcept C171250308 @default.
• W2326846524 hasConcept C180145272 @default.
• W2326846524 hasConcept C192560794 @default.
• W2326846524 hasConcept C192562407 @default.
• W2326846524 hasConcept C204223013 @default.
• W2326846524 hasConcept C204787440 @default.
• W2326846524 hasConcept C20556612 @default.
• W2326846524 hasConcept C2777289219 @default.
• W2326846524 hasConcept C2779227376 @default.
• W2326846524 hasConcept C49040817 @default.
• W2326846524 hasConcept C544956773 @default.
• W2326846524 hasConcept C61441594 @default.
• W2326846524 hasConcept C62520636 @default.
• W2326846524 hasConcept C71924100 @default.
• W2326846524 hasConcept C97355855 @default.
• W2326846524 hasConceptScore W2326846524C111368507 @default.
• W2326846524 hasConceptScore W2326846524C120665830 @default.
• W2326846524 hasConceptScore W2326846524C121332964 @default.
• W2326846524 hasConceptScore W2326846524C127313418 @default.
• W2326846524 hasConceptScore W2326846524C134406635 @default.
• W2326846524 hasConceptScore W2326846524C136525101 @default.
• W2326846524 hasConceptScore W2326846524C142724271 @default.
• W2326846524 hasConceptScore W2326846524C15336307 @default.
• W2326846524 hasConceptScore W2326846524C159985019 @default.
• W2326846524 hasConceptScore W2326846524C171250308 @default.
• W2326846524 hasConceptScore W2326846524C180145272 @default.
• W2326846524 hasConceptScore W2326846524C192560794 @default.
• W2326846524 hasConceptScore W2326846524C192562407 @default.
• W2326846524 hasConceptScore W2326846524C204223013 @default.

• next