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- W2327002321 abstract "This paper describes an automatic solder joint inspection system by X-ray imaging. The following were developed for highly reliable inspection of J-lead and gull-wing lead solder joints : (1) An automatic inspection method for double side-mounted PCBs (Printed Circuit Boards) by micro-focus X-ray imaging and board tilting, (2) Enhancement of X-ray image of solder joints by logarithmic transformation of a detected image, (3) Fillet judgement by comparison between a detected image and a number of typical nondefective images selected by a clustering procedure, (4) Bridge determination by multi-step thresholding and comparison between pattern frequency distribution of a detected image and that of a nondefective image. The inspection system developed with these technologies had a defect detection rate of 100% with the smallest detectable defect being 50 μm." @default.
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- W2327002321 date "1993-01-01" @default.
- W2327002321 modified "2023-09-26" @default.
- W2327002321 title "Automatic Solder Joint Inspection System by X-ray Imaging." @default.
- W2327002321 doi "https://doi.org/10.2493/jjspe.59.65" @default.
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