Matches in SemOpenAlex for { <https://semopenalex.org/work/W2328685910> ?p ?o ?g. }
Showing items 1 to 87 of
87
with 100 items per page.
- W2328685910 endingPage "172" @default.
- W2328685910 startingPage "165" @default.
- W2328685910 abstract "Abstract The demand for electronic packages with lower profiles, lighter weights, and higher I/O densities are leading to a rapid expansion of the electronics industry, especially in portable electronic products. As a result, flip chip technology has become very popular in the electronic packaging industry. To enhance the long‐term reliability of flip chip technology, the space between the chip and substrate must be filled. This underfill improves reliability, which is influenced by coefficient of thermal expansion (CTE) mismatch between the chip and the substrate. However, it is difficult to fill the underfill space perfectly between the chip and the substrate because of the presence of impurities, voids and other defects in solder joining and underfilling during manufacturing. In addition, it is nearly impossible to achieve a perfect contact between the solder joints and the underfill. The purpose of this research is to investigate the impact of imperfect contact behavior and contact performance involving the solder joints and underfill on flip chip solder interconnects. Because of the above reliability issues, this study adopted the contact theory of the finite element and element death/birth methods to analyze the physical behavior of packaging structures under thermal cycling conditions. Simulation results indicated that the fatigue life of the flip chip packages would decrease due to two phenomena: One is imperfect bonding between solder ball and underfill, and the other is void size exceeding 334 μm2. Subsequently, this study effectively utilized a novel finite element method to simulate the real manufacturing processes of flip chip packaging." @default.
- W2328685910 created "2016-06-24" @default.
- W2328685910 creator A5048848380 @default.
- W2328685910 creator A5069751039 @default.
- W2328685910 date "2004-03-01" @default.
- W2328685910 modified "2023-09-27" @default.
- W2328685910 title "Reliability analysis of flip chip packages using contact finite element method" @default.
- W2328685910 cites W1980144854 @default.
- W2328685910 cites W2010198069 @default.
- W2328685910 cites W2103838370 @default.
- W2328685910 cites W2125884240 @default.
- W2328685910 cites W2138351836 @default.
- W2328685910 doi "https://doi.org/10.1080/02533839.2004.9670861" @default.
- W2328685910 hasPublicationYear "2004" @default.
- W2328685910 type Work @default.
- W2328685910 sameAs 2328685910 @default.
- W2328685910 citedByCount "3" @default.
- W2328685910 countsByYear W23286859102012 @default.
- W2328685910 countsByYear W23286859102023 @default.
- W2328685910 crossrefType "journal-article" @default.
- W2328685910 hasAuthorship W2328685910A5048848380 @default.
- W2328685910 hasAuthorship W2328685910A5069751039 @default.
- W2328685910 hasConcept C119599485 @default.
- W2328685910 hasConcept C121332964 @default.
- W2328685910 hasConcept C127413603 @default.
- W2328685910 hasConcept C135628077 @default.
- W2328685910 hasConcept C138331895 @default.
- W2328685910 hasConcept C159985019 @default.
- W2328685910 hasConcept C163258240 @default.
- W2328685910 hasConcept C165005293 @default.
- W2328685910 hasConcept C186260285 @default.
- W2328685910 hasConcept C192562407 @default.
- W2328685910 hasConcept C24326235 @default.
- W2328685910 hasConcept C2779227376 @default.
- W2328685910 hasConcept C2779772531 @default.
- W2328685910 hasConcept C43214815 @default.
- W2328685910 hasConcept C49040817 @default.
- W2328685910 hasConcept C50296614 @default.
- W2328685910 hasConcept C530198007 @default.
- W2328685910 hasConcept C62520636 @default.
- W2328685910 hasConcept C66938386 @default.
- W2328685910 hasConcept C68928338 @default.
- W2328685910 hasConcept C78519656 @default.
- W2328685910 hasConcept C79072407 @default.
- W2328685910 hasConceptScore W2328685910C119599485 @default.
- W2328685910 hasConceptScore W2328685910C121332964 @default.
- W2328685910 hasConceptScore W2328685910C127413603 @default.
- W2328685910 hasConceptScore W2328685910C135628077 @default.
- W2328685910 hasConceptScore W2328685910C138331895 @default.
- W2328685910 hasConceptScore W2328685910C159985019 @default.
- W2328685910 hasConceptScore W2328685910C163258240 @default.
- W2328685910 hasConceptScore W2328685910C165005293 @default.
- W2328685910 hasConceptScore W2328685910C186260285 @default.
- W2328685910 hasConceptScore W2328685910C192562407 @default.
- W2328685910 hasConceptScore W2328685910C24326235 @default.
- W2328685910 hasConceptScore W2328685910C2779227376 @default.
- W2328685910 hasConceptScore W2328685910C2779772531 @default.
- W2328685910 hasConceptScore W2328685910C43214815 @default.
- W2328685910 hasConceptScore W2328685910C49040817 @default.
- W2328685910 hasConceptScore W2328685910C50296614 @default.
- W2328685910 hasConceptScore W2328685910C530198007 @default.
- W2328685910 hasConceptScore W2328685910C62520636 @default.
- W2328685910 hasConceptScore W2328685910C66938386 @default.
- W2328685910 hasConceptScore W2328685910C68928338 @default.
- W2328685910 hasConceptScore W2328685910C78519656 @default.
- W2328685910 hasConceptScore W2328685910C79072407 @default.
- W2328685910 hasIssue "2" @default.
- W2328685910 hasLocation W23286859101 @default.
- W2328685910 hasOpenAccess W2328685910 @default.
- W2328685910 hasPrimaryLocation W23286859101 @default.
- W2328685910 hasRelatedWork W1982340837 @default.
- W2328685910 hasRelatedWork W1991291398 @default.
- W2328685910 hasRelatedWork W2011847960 @default.
- W2328685910 hasRelatedWork W2113641968 @default.
- W2328685910 hasRelatedWork W2152150115 @default.
- W2328685910 hasRelatedWork W2163745963 @default.
- W2328685910 hasRelatedWork W2185733473 @default.
- W2328685910 hasRelatedWork W2564382641 @default.
- W2328685910 hasRelatedWork W2793860978 @default.
- W2328685910 hasRelatedWork W4233052666 @default.
- W2328685910 hasVolume "27" @default.
- W2328685910 isParatext "false" @default.
- W2328685910 isRetracted "false" @default.
- W2328685910 magId "2328685910" @default.
- W2328685910 workType "article" @default.