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- W2328923520 abstract "With the emergence of new power semiconductor devices and packaging technologies, the power density of the power packages or modules is increasing rapidly. Double-sided cooling power packages maximize heat dissipation by enabling heat removal from both the top and bottom sides of the module. This article compares single-sided and double-sided cooling power packaging structures to elucidate advantages and disadvantages of these packaging structures in terms of thermal and thermo-mechanical based on finite element simulations. Simulation results reveal that double-sided cooling power packages greatly improve their thermal performances, but they face challenges due to their high thermo-mechanical stresses. The use of a viscoelastic underfill resin and a coefficient of thermal expansion–matched ceramic chip carrier in the double-sided cooling power packaging structure is shown to reduce thermo-mechanical stresses." @default.
- W2328923520 created "2016-06-24" @default.
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- W2328923520 date "2016-01-01" @default.
- W2328923520 modified "2023-09-24" @default.
- W2328923520 title "Thermo-mechanical Simulations for Single-Sided and Double-Sided Cooling Power Packages" @default.
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- W2328923520 doi "https://doi.org/10.4071/imaps.495" @default.
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