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- W2331215650 abstract "The curing of polymer dielectrics on organic laminates by variable frequency microwave (VFM) processing was studied. Polymer dielectrics, such as polyimides, normally require long cure times at elevated temperatures resulting in processing incompatibility with epoxy-based laminates due to the low thermal stability of the organic laminates. In this study, VFM processing was investigated as an alternative, low temperature technique for curing polyimide and benzycyclobutene (BCB) on metallized bismaleimide triazine/epoxy (BT) board. The VFM heating characteristics of the metallized (BT) boards were studied. The VFM heating rates of the BT boards strongly depended on the configuration, size, and shape of the copper patterns on the boards. The VFM curing of polyimide and BCB on the metallized BT boards was also performed. The curing condition was optimized to minimize board degradation. At the same board degradation level, the chemical, thermo-mechanical and electrical properties of the VFM cured film were compared with a film thermally cured using a conventional convection furnace. A higher degree of curing and lower dielectric constant was achieved for benzocyclobutene (BCB) films on BT boards processed using VFM curing than was obtained using conventional curing. VFM cured polyimide (PI 2611) showed a similar degree of curing and Young's modulus to conventionally cured PI 2611. However, the VFM cured PI 2611 showed a higher residual content solvent and a higher dielectric constant than conventionally cured PI 2611." @default.
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- W2331215650 date "2005-04-01" @default.
- W2331215650 modified "2023-09-27" @default.
- W2331215650 title "Low Temperature Rapid Curing of Polymer Dielectrics on Metallized Organic Laminates by Variable Frequency Microwave Processing" @default.
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- W2331215650 doi "https://doi.org/10.4071/1551-4897-2.2.142" @default.
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