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- W2331970515 abstract "Catalyst-referred etching (CARE) is a novel abrasive-free planarization method. CARE-processed 4H-SiC(0001) surfaces are extremely flat and undamaged over the whole wafer. They consist of single-bilayer-height atomic steps and atomically flat terraces. This suggests that the etching properties depend principally on the atomic-step density of the substrate surface. We used on-axis and 8 degrees off-axis substrates to investigate the processing characteristics that affect the atomic-step density of these substrates. We found a strong correlation between the removal rate and the atomic-step density of the two substrates. For the on-axis substrate, the removal rate increased with increasing surface roughness, which increases with an increasing atomic-step density. The removal rate ratio is approximately the same as the atomic-step density ratio of the two substrates." @default.
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- W2331970515 date "2011-04-01" @default.
- W2331970515 modified "2023-09-29" @default.
- W2331970515 title "Dependence of Process Characteristics on Atomic-Step Density in Catalyst-Referred Etching of 4H–SiC(0001) Surface" @default.
- W2331970515 doi "https://doi.org/10.1166/jnn.2011.3917" @default.
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